Our PCBA services encompass both through-hole (conventional) and surface mount (SMT) assembly capabilities. They range from initial production of prototypes (as part of our NPI process), through to the ongoing manufacture of complex, multi-technology PCBAs, in low to medium volumes.

We produce both leaded and RoHS compliant products, utilising our five Mycronic surface mount placement machines for SMT assembly. Or, we can form, populate and solder through-hole components to PCBs, either by hand or by using our automatic soldering processes. 

PCB product realisation services

Our product realisation services take customers through from initial design concepts to full production. Our experienced account managers - along with our engineering, manufacturing and NPI teams - operate in partnership with our customers. We ensure successful new product introductions, on time and within budget.

A typical JJS product realisation initiative includes:

PCB prototyping and NPI

Our NPI team uses a tried and tested approach, to deliver new product introductions.

Our use of advanced project management tools, including critical path analysis (along with common sense strategies, such as attention to detail and frequent communication), guides customers through the NPI process.

Beginning at the request for quotation (RFQ) stage, the NPI process involves our business development team reviewing the requirements of a product or project and analysing the build pack, data and specifications.

When we receive a purchase order, a formal handover process takes place. We then develop a comprehensive project plan. Our team uses detailed documentation, engineering change and reporting control, to ensure continued information integrity.

An experienced Account Manager acts as the interface between JJS and our customers. Although, at the same time, we encourage engineer-to-engineer communication. The designated project manager allocates resources and tracks all tasks throughout the NPI process. The result is a seamless transition into manufacturing.

5 questions on sending an RFQ to a contract electronics manufacturer

SMT PCB assembly

Since we first complemented our through-hole (conventional) PCB assembly services, by offering customers the ability to place surface mount (SMT) devices, the technology has progressed.

Yet, JJS has invested in people, processes and some of the finest equipment available. This approach has enabled us to deliver to customers' requirements - in terms of flexibility, responsiveness, quality and lead-times.

We have five Mycronic surface mount placement machines, configured as three fully integrated lines, for the main production. Each line has a DEK Horizon or 265 printer and a BTU 8 zone oven, connected with automatic conveyors and loaders/unloaders, and an in-line Mirtec AOI system. Also, we have invested in off-line setup facilities, including Agilis feeders, to allow the rapid and accurate changeover of jobs.

JJS’s Mycronic placement machines use rapid-change intelligent feeders that can handle components from 01005 resistors to ball grid array (BGA), and fine pitch devices up to 70mm2. All common (and less common) PCB substrate materials are populated, including FR4, flexi, flexi-rigid and metal backed laminates. Pb (if RoHS exempt) and RoHS compliant Pb-free processes are available, both to IPC-A-610 class 2 or 3 as required.

Solder paste printing is a critical process, which our DEK automatic printers achieve accurately and consistently. They have built-in, automatic optical inspection for verification, "GridLok" PCB supports, and "ProActiv" for ultra-fine pitch printing.

Solder paste reflow is carefully profiled and processed using BTU Pyramax 100A8-zone convection ovens. Our SMT processes are supported by experienced IPC trained technicians, using the latest technology equipment for process set-up and verification. All SMT assemblies are AOI inspected, using in-line and Mirtec AOI systems. First-off verification is assisted using "Extra Eye" guided inspection, with microscopes, Ersa Scope and X-ray available for fine pitch and BGA inspection.

Our materials control facilities include baking ovens and dry storage chambers for correct conditioning and storage of components and assemblies. For modifications and upgrades, two fully equipped fine pitch/BGA re-work stations are available.

Why the right preparation is crucial for your New Product Introduction

Conventional PCB assembly

As well as investing in surface mount technology, JJS Manufacturing also has a fully equipped through-hole facility. We have a skilled workforce of around 40 people, located in our UK and Czech manufacturing facilities.

These IPC-A-610 trained operators and technicians have an array of tools and equipment at their disposal, to enable them to perform all the operations required by JJS’s customers. Through-hole components are formed, populated and soldered by hand or automatic soldering processes using our ERSA Versaflow 3/45 selective solder machine.

Three dedicated Blundell CMS400(LF) wave solder machines offer volume soldering capability for tin-lead and unleaded solder, depending on the RoHS status of the product being assembled. Manual conformal coating and encapsulation services are also available if required, for customers whose products operate in environments where safety, security or humidity are an issue. With both leaded and lead-free soldering, we have no-clean, solvent, ultrasonic and aqueous cleaning processes available.

The through-hole process can be completed with functional or Teradyne in-circuit ATE test, before shipment or inclusion in the next build process.

PCB test and inspection

JJS is experienced in designing and implementing a variety of test techniques to ensure products are reliable and thoroughly tested – saving customers' time and money downstream by reducing field failures.

We develop sound test and inspection strategies that verify defined product quality and functionality, in addition to manufacturing process integrity.

Every PCBA undergoes full, high-resolution AOI inspection through Mirtec MV-3L machines on each line, with images retained for several months. All boards are traceable by the individual bar code. A rigorous first-off inspection process is performed on each build, complemented by a robust NPI procedure for new products.

All JJS production staff are IPC trained and attend residential courses with the equipment manufacturers, as well as ongoing training and development. Build documents and machine programs are produced from customer’s CAD information using Aegis CircuitCAM processing software, with DFT/DFM advice given before committing to orders. This all results in process quality exceeding 5 Sigma. Advanced Ersa rework stations are available for product upgrades and repair of field returns.

Our in-depth technical assessment is based on the following considerations:

  • Product design requirements
  • Testability requirements
  • Component types
  • Product complexity
  • Manufacturing process
  • Product maturity
  • Product lifecycle implications

By assessing the above factors in detail, we can predict the defects most likely to occur in the manufacturing process. Our customers have boosted both the cost effectiveness and reliability of their end products, by taking this assessment into account. 

Since we offer an extensive range of test options, we will provide the most appropriate test strategy for your products.

A Step-by-Step Guide to New Product Introduction (NPI)

A huge amount of preparation work needs to take place behind the scenes before any NPI build can begin. And the NPI process ensures that your product design and our internal assembly processes are perfectly aligned.

The first six months - Working in partnership with JJS